MURS320T3G, SURS8320T3G, MURS340T3G, SURS8340T3G, MURS360T3G,
SURS8360T3G
http://onsemi.com
6
PACKAGE DIMENSIONS
SMC
PLASTIC PACKAGE
CASE 403?03
ISSUE E
DIM
A
MIN NOM MAX MIN
MILLIMETERS
1.90 2.13 2.41 0.075
INCHES
A1
0.05 0.10 0.15 0.002
b
2.92 3.00 3.07 0.115
c
0.15 0.23 0.30 0.006
D
5.59 5.84 6.10 0.220
E
6.60 6.86 7.11 0.260
L
0.76 1.02 1.27 0.030
0.084 0.095
0.004 0.006
0.118 0.121
0.009 0.012
0.230 0.240
0.270 0.280
0.040 0.050
NOM MAX
7.75 7.94 8.13 0.305
0.313 0.320
HE
4.343
0.171
3.810
0.150
2.794
0.110
mm
inches
SCALE 4:1
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
E
bD
L1
c
L
A1
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.
4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.
HE
0.020 REF
0.51 REF
L1
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